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AL2O3,thin film circuit Inquiries(0) Tags:99.6%AL2O3,98%ALN,Sio2,BeO Price: US $47.430-50 Quantity: piece Total price:US $0.00 (Excluding shipping cost) Add to Inquiry Cart Add to Wish List (0 Adds) Ship From: Qingdao Support Payment Terms: T/T,L/C,D/P,D/A thinfilm 2018 Registered

Shandong, China. This supplier has been open since 2003

Business Type: Trading company Main Products: Thin film circuit,Photo Mask,Laser Drilling,Laser Resistor Trimming,polyimide bridges,Film circuit substrate,Ceramic film metallization Seller Homepage
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Item Specifications
  • Substrate thickness:0.002~0.004in
Product Description
Thin film ceramic circuit:
1. Product features:
 
The thin film circuit refers to a circuit that forms a specific function by integrating a resistor, an inductor, and a metal conduction band on a ceramic substrate through a semiconductor process such as sputtering, photolithography, and electroplating. Mainly have the following characteristics:
 
High integration, small volume
 
High line accuracy and excellent component performance
 
Excellent temperature stability and frequency characteristics, use frequency up to millimeter wave
2. Product use:
 
Communications: microwave millimeter wave communications, optical communications, radio communications; LED high-power lighting; sensor technology; medical imaging; biotechnology. Typical devices include Langer coupling bridges, splitter filters, transmission lines, circulators, isolators, resistors, attenuators, and heat sinks.
3. Process characteristics:
 
Supports the production of thin film integrated circuits that meet the customer's special pattern requirements on a number of ceramic substrates such as alumina, aluminum nitride, yttrium oxide, ferrite, and microwave substrates. * Fine metal strip width 0.02mm, metal strip * small pitch 0.02mm, precision ± 0.002mm; product * small appearance size 0.2mm × 0.2mm, precision ± 0.02mm; * small resistance 1Ω, * large resistance 50KΩ, accuracy 5% , 10%, special precision up to 0.5% (using laser trimming).
 
Supports fine lines, fine circuit fabrication, patterned ceramic side edges, metallization, side wall cladding, and double-sided patterned circuit fabrication.
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