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Yttrium oxide (beo), interdigital electrode DPC membrane circuit for IDAM Ceramic circuit board PCB Circular electrode 0.35A 0.25V biometric sensor Inquiries(0) Tags:Aviation, aerospace, weapons, ships, communications, electronics Price: US $1.001-50 Quantity: piece Total price:US $0.00 (Excluding shipping cost) Add to Inquiry Cart Add to Wish List (0 Adds) Ship From: Qingdao Support Payment Terms: T/T thinfilm 2018 Registered

Shandong, China. This supplier has been open since 2003

Business Type: Factory/Manufacturer Main Products: RF Microwave Thin film circuit,Photo Mask,Laser Drilling,Laser Resistor Trimming,polyimide bridges,Ceramic film metallization,Single layer Capacitor,Metal substrate/Chip carrier,50 ohm Microstrip Transmission Line,Thin Film Attenuator Seller Homepage
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Item Specifications
  • PCS:10000
Product Description

WMC THIN-FILM PRODUCTS


1. Substrate Type and Specifications

Substrate Material

Purity

A Surface

Roughness

B Surface

Roughness

Dielectric

Constant

Thermal

Conductivity

Dissipation Factor

(Loss Tangent)

%

µ"

µ"

@1MHz

W/mK

@1MHz

Asfired Alumina (Al2O3)

99.6

3

3

9.9±1

26.9

0.0001

Polished Alumina (Al2O3)

99.6

1

1 or 12

9.9±1

26.9

0.0001

Aluminum Nitride (AlN)

98

3

3

8.6

170

0.001

Beryllium Oxide (BeO)

99.5

3

10

6.5

270

0.0004

Sapphire (Crystalline)

100

1

1

10.0

-

0.00086

Fused Silica (SiO2)

100

1

1

4.4

-

0.000015

Ferrites and Garnets

-

16

16

14.5–17.6

-

-

Polished Titanates

-

3

3

36–180

-

-


2. Metalizations

Metallization

System

Application

component

Attachment Method

Typical

thickness range

Max. use

temperature

TiW/Au

Standard thin film metal system for conductors

Au/SnAu/SiAu/Ge

EutecticEpoxy

TaN25–100Ω /sq

TiW500–800Å

Au0.5–5µm

typical =3µm

425℃

TaN/TiW/Au

Standard thin film metal system for conductors with resistor layer

380℃

TiW/Ni/Au

Conductor applications that require Pb/Sn soldering

Au/SnAu/SiAu/Ge

EutecticPb/SnEpoxy

TaN25–100Ω /sq

TiW500–800Å

Ni1000–10000Å

Au0.5–5µm

typical =3µm

350℃

TaN/TiW/Ni/Au

Conductor with resistor layer applications that require Pb/Sn soldering

350℃

TaN/TiW /Au/

Cu/Ni/Au

High current low loss applications

Au/SnAu/SiAu/Ge

EutecticPb/Sn

TaN25–100Ω /sq

TiW500–800Å

Ni1000–10000Å

Au0.2–1µm

Cu0.5–12µm

Ni0.5–2µm

350℃

Ti/Pt/Au/AuSn

brazing temperature Moderate , high strength, low viscosity

 

Au/Sn

Ti500–800Å

Pt0.2–1µm

Au0.2–1µm

AuSn1.5–10µm

200



4The circuit can be on a substrate having through holes or cutouts.

Air bridges, side (surround) patterns and AuSn solder patterns can be used.

Conductors, thin film resistors, film capacitors and thin film inductors can be used on a single board.

Membrane system: Ti, TiW, Cr, CrNi, TaN, Cu, Ni , Pt, Au, AuSn.

Thin film resistor material: TaN (thin film resistance: 25Ω, 50Ω, 75Ω,100Ω)

Predeposited Gold/Tin (Au/Sn): Au / Sn 75:25

By combining fine patterns on a 99.9% alumina substrate, a low-loss, low-noise circuit high frequency band can be fabricated.

We also process other materials such as high dielectric constant substrates, aluminum nitride substrates (AlN substrates) and quartz substrates.

As a professional manufacturer of thin film circuits, we have comprehensive technical development, quality assurance and problem solving expertise.

5Second, the application environment
1, can be applied to the bonding process, using gold / aluminum / silver wire, epoxy conductive paste, gold tin eutectic
2, good heat cycle resistance
3, High stability and high reliability
4, working temperature -150 °C ~ +450 °C
5, small size, size up to 0.3 * 0.3mm, tolerance ± 30 ~ 50μm controllable
6, size and parameters can be customized

6. Third, the scope of application
1, high performance RF, microwave, THz, millimeter wave, Photoelectron, Microwave and optoelectronicsOptical communicationHybrid integrated module (integrated module, semiconductor module, infrared thermopile, photoelectric module, power module, etc.), high frequency band, low loss, low noise circuits and heat dissipating materials Wait related thin film components such of Development and production. Products are widely used in aviation, aerospace, weapons, ships, communications, electronics and other fields.

2, Alumina ceramic, Ceramic substrates, Dielectric ceramic, Substrates, AL2O3 Alumina, Titanates, Yttrium oxide(beo), (ALN) Aluminum nitride, Aluminum nitride substrates (AlN substrate), Sapphire, Ferrite, Sio2 Quartz glass, Silicon, Quartz, Quartz substrates, Fused silica glass, Thin Film sputtering, Thin Film, Metallization, Electroforming, Gold Plating , Circuit board, Ceramic circuit board , Glass circuit board, Glass circuit, Printed circuit board, Ceramic Circuit, Microwave Circuits, RF Circuits, Alumina ceramic thin film circuit, Ceramic thin film circuit, Photoelectric circuit, Microwave circuit , Microwave thin film circuits, Attenuator 10db attenuator, Chip, Thin Film temperature sensor, Temperature Sensor, Thin Film resistance thermometer, Interdigital electrodes Comb sensor, Interdigital electrodes , Thermistor , Bare Chip, Microstrip Lines, Transmission Lines, Transmission lin , Microstrip line, Microstrip transmission line, 50 ohm, 25 ohm 50 watt resistor , Sputtering gold, vacuum coating , Coating, Optical Coatings , Resistors , THIN FILM RESISTORS CHIPS, Thin Film Resistor, Resistive films, Multi-Tap, Multi-Tap Networks, Chip resistor, Thin Film Chip Resistors, Electrodes , Gold electrode , Micro Electrode, Chip Inductors , Inductive component, Inductor Coils, Laser machining, Laser Cut Ceramics , RF and microwave filter , RF passive components , AuSn Solder, Ceramic resonator, Ti/Pt, Ti/Au, TiW/Au, Ti/Pt/Au, TiW/Ni/Au, Thin Film Circuits, Ni/Cr, TaN, Standoff Capacitors, Binary Capacitors, Electrode Capacitor, Micro Capacitor, Decoupling capacitor, Ceramic capacitor, Gold Capacitor, Capacitance, Thin Film Capacitor, DPC Capacitor Gold electrode DPC, Thin Film capacitor, Ultra Capacitor, Laser diode,Submount , Ceramic heat sink, Heat Sinks , Ground Blocks, Low lossGround Block, Conductive Ceramic , Stand Off , Isolation Pads, Conductor, Side Patterns, Diode Submounts,LD, PD submounts LDPD, Optical devices, High frequency optics, Printed circuit board fabrication, High Frequency Devices , Band pass filter, Bandwidth formula, Active high pass filter , Passive high pass filter, Conductive Coatings, Laser trimming , Ultra Bridge, Plated Through Vias , Plated Through Holes, Low pass filter, Sensor Material , Temperature Sensor, Thermocouple, Biometric Sensor, High Chemical Stability, Ceramic Technology, Hybrid Ceramic, Optical transceiver, Wireless and optical, Resonator , Integrated circuit, Electronic circuit, Insulator, Microlithography, Sputtering, Evaporators, E-beam, Photodiodes, Laser diodes, Sub-carriers, Filter circuits, Sensor head, Sensor head circuit substrates, MEMS gyroscope, MEMS accelerometer, Charge amplifier, temperature converter, Preamplifier,optical fiber detector, Microwave Part, Ceramic Connector, Ceramic Packages, Filters, Lange Couplers,Microwave Devices and Circuits, Monolithic microwave integrated circuit, Custom circuit, Fiber optic sensor, Flexible Circuits, Printed circuit board fabrication, High Frequency Devices, RF and Microwave, Thin Film deposition technology, Deposition, Circuit Fabrication, Thin Film manufacturing,Thin Film Fabrication, Polyimide (flex circuits), Printed circuit board fabrication service, Band pass filter circuit diagram, Low dielectric constant, Hybrid integrated, Metal material processing, Thin Film Integrated Circuits, Oscillator circuits , Amplification circuits, Frequency conversion circuits, High-dielectric constant substrates, Fixed Attenuator Pads, Microwave Component, Microwave module, RF module, Fourth.


7. The packaging method

waffle packs                                Anti-static packaging 

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